SELF-ASSEMBLY OF CHIP-SIZE COMPONENTS WITH CAVITY STRUCTURES: HIGH-PRECISION ALIGNMENT AND DIRECT BONDING WITHOUT THERMAL COMPRESSION FOR HETERO INTEGRATION

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

New surface mounting and packaging technologies, using self-assembly with chips having cavity structures, were investigated for three-dimensional (3D) and hetero integration of complementary metal-oxide semiconductors (CMOS) and microelectromechanical systems (MEMS).By the surface tension of small droplets of 0.5 wt% hydrogen fluoride (HF) aqueous

read more